Nyob rau hauv daim ntawv thov xav tau huab cua nyias, thermal conductivity, thiab ib puag ncig tsis kam-xws li hluav taws xob sib dhos, kev tswj xyuas thermal, thiab micro-module bonding-cov kab xev ib txwm ua tsis zoo vim qhov tuab tuab lossis tsis zoo sib xws. TESA 68549 yog ib qho ultra-nyias, pob tshab, ob-sided daim kab xev nrog tshwj xeeb thermal conductivity, tsim los rau precision electronics, muab ib tug txhim khu kev qha kev daws teeb meem rau nqaim-gap bonding thiab tshav kub dissipation.
I. Core Product Positioning
TESA 68549 yog 20µm-thick pob tshab ob sab daim kab xev, featuring ib ultra-thin PET thaub qab + hloov kho acrylic nplaum, haum rau:
✔ Microelectronic Cheebtsam sib txuas
✔ Mounting thermal pads / heat spreaders
✔ NFC kav hlau txais xov / sensor module txuas
✔ Ultra-thin gap filling & high-precision sib dhos
II. Technical Specifications Txheej txheem cej luam
| Qeb Parameter | Technical Specifications | Kev lag luam tseem ceeb |
|---|---|---|
| Cov ntaub ntawv thaub qab | PET Zaj duab xis (pob tshab, 2µm tuab) | Ultra-nyias, yoog raws, thiab stackable |
| Tag nrho Thickness | 20 µm | Minimizes chaw ua hauj lwm hauv micro-assembly |
| Hom nplaum | Hloov kho Acrylic | Ua kom muaj zog ntub dej & adhesion stability |
| Thawj Tack | Tsawg | Tso cai rau qhov chaw thiab kev kho kom raug |
| Short-Term Temp. Kev tiv thaiv | 200 ° C | Withstands reflow soldering & kub nias |
| Lub Sij Hawm Ntev. Kev tiv thaiv | 100 ° C | Txhim khu kev ua tau zoo tshaj cov khoom lifespan |
| Resistance to Moisture/Chemicals/UV | Zoo heev | Nyob ruaj khov nyob rau hauv ib puag ncig hnyav |
| Static Shear Strength (23 ° C) | Nruab nrab | Ruaj ntseg lub teeb yuag yam tsis muaj slippage |
III. Plaub Qhov Zoo Tshaj Plaws
- Ultra-thin & Precision Bonding
Tsuas yog 20µm tag nrho cov tuab (2µm PET thaub qab), TESA 68549 ua rau "tsis pom kev sib txuas" yam tsis muaj kev cuam tshuam rau kev tsim qauv, zoo tagnrho rau micro-gap filling. - Superior Thermal conductivity
Cov qauv ultra-nyias + zoo ntub ntub dej kom muaj kev sib cuag nrog cov chaw, txhim kho kev hloov hluav taws xob rau cov hluav taws xob hluav taws xob & IC modules. - Siab Environmental Resistance
Kev tiv thaiv zoo rau cov av noo, tshuaj lom neeg, thiab UV kev laus, ua kom muaj kev ruaj ntseg nyob rau hauv qhov kub thiab txias, high humidity, los yog sab nraum zoov. - Saj zawg zog Conformability
Nyias tsis tau hloov pauv PET thaub qab hloov mus rau qhov chaw nkhaus, ua rau nws zoo tagnrho rau NFC kav hlau txais xov, hloov pauv hloov pauv, thiab MEMS modules.
IV. Tej kev siv
- Electronic Module Assembly: Lub koob yees duab modules, ntiv tes sensors
- Kev Tswj Thermal: Kev sib txuas ntawm cov cua sov kom ua kom txias zoo dua
- NFC / Kav hlau txais xov Bonding: Smartphones, wearables nrog me me kav hlau txais xov
- Sensor Mounting: Precision txuas ntawm saj zawg zog temp / siab sensors
- Transparent Structures: High optical clarity rau zaub / teeb pom kev zoo
V. Technical Q&A
❓ Q: Puas yog TESA 68549 muab thermal conductivity? Vim li cas "zoo heev hloov tshav kub"?
→ Yog. Nws cov qauv ultra-thin + nplaum ntub dej kom ntseeg tau tias muaj cua sov dissipation, zoo tagnrho rau kev tswj xyuas thermal tsawg.
❓ Q: Puas yog daim kab xev tuaj yeem tawg lossis tsis muaj zog adhesion vim yog nyias?
→ Tsis yog PET thaub qab yog hloov tau yooj yim, thiab cov nplaum acrylic ua kom muaj zog, ruaj khov kev sib raug zoo.
❓ Q: Haum rau qhov chaw ntub dej / sab nraum zoov?
→ Yog. Nws tiv taus ya raws, UV, thiab tshuaj lom neeg, ua tau zoo hauv kev xav tau.
Post lub sij hawm: May-30-2025